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Published in 2018 at "Micromachines"
DOI: 10.3390/mi9120621
Abstract: In this paper, a direct pre-bonding technology after alignment of the chip is presented to avoid the post-misalignment problem caused by the transferring process from an alignment platform to a heating oven. An alignment system…
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Keywords:
micro nanofluidic;
nanofluidic chip;
alignment system;
chip ... See more keywords