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Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-9684-x
Abstract: This work studied the additions of nano-Cu6Sn5 intermetallic particles into a lead-free Sn3.0Ag0.5Cu (SAC305) solder alloy with content ranging from 0.05 to 2 wt%. The thermal behavior, mechanical properties and interfacial reaction of Cu6Sn5 nanoparticle containing…
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Keywords:
nanoparticles addition;
thermal behavior;
sn3 0ag0;
solder ... See more keywords
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Published in 2020 at "Fuel"
DOI: 10.1016/j.fuel.2019.116609
Abstract: Abstract The present study reports an investigation about the distinct effects of nanoparticles addition and urea-SCR system on NOx emissions. Also nano-additives influence on pollutants (NOx and CO) reduction performance of a urea-SCR system is…
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Keywords:
nanoparticles addition;
urea scr;
system;
nox emissions ... See more keywords
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Published in 2019 at "Materialia"
DOI: 10.1016/j.mtla.2019.100234
Abstract: Abstract The effects of Ni nanoparticles addition on the microstructure, electrical resistivity and mechanical properties such as elastic/shear moduli, microhardness and creep of Sn-3.0Ag-0.5Cu (SAC305; in wt.%) electronic interconnect materials have been investigated. Microstructure analysis…
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Keywords:
effects nanoparticles;
imc;
addition microstructure;
addition ... See more keywords