Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior
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DOI: 10.1016/j.jallcom.2021.158726
Abstract: Abstract Problems associated with the oxidation of Cu nanopaste have been widely studied in efforts to develop a replacement for Ag nanopaste. The intensive pulsed light (IPL) sintering process has been suggested to solve the… read more here.
Keywords: migration behavior; nanopaste; electrochemical migration; pulse power ... See more keywords