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Published in 2022 at "Advanced Materials"
DOI: 10.1002/adma.202200734
Abstract: With the reduction of feature size and increase of integration density, traditional 3D semiconductors are unable to meet the future requirements of chip integration. The current semiconductor fabrication technologies are approaching their physical limits based…
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Keywords:
technologies materials;
integrated electronic;
optoelectronic devices;
nanopatterning technologies ... See more keywords