Design and Characterizations of a Planar Multichip Half-Bridge Power Module by Pressureless Sintering of Nanosilver Paste
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2019.2905773
Abstract: A planar phase-leg 650-V/240-A insulated-gate bipolar transistor (IGBT) module with 16 IGBT chips and 16 free-wheeling diodes has been demonstrated by pressureless sintering nanosilver paste to achieve extremely high power density and low parasitic inductance.… read more here.
Keywords: tex math; nanosilver paste; power; inline formula ... See more keywords
A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Electron Devices"
DOI: 10.1109/ted.2018.2867362
Abstract: This paper proposed a new approach to attach power devices on nonmetallized direct bonding copper (DBC) substrates by pressureless sintering of nanosilver paste in poor-oxygen sintering atmosphere and formic acid reduction atmosphere. The average shear… read more here.
Keywords: power; nanosilver paste; formic acid; pressureless sintering ... See more keywords