In situ investigation on melting characteristics of 1D SnCu alloy nanosolder
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DOI: 10.1088/1361-6528/ac659c
Abstract: Nanosoldering can bond various nanomaterials together or connect them with electrodes to form electrical contacts, thus assembling these nanomaterials into functional nanodevices; it is believed to be a promising interconnection technique due to its flexibility,… read more here.
Keywords: nanosolder; investigation melting; melting characteristics; situ investigation ... See more keywords