Detwinning through migration of twin boundaries in nanotwinned Cu films under in situ ion irradiation
Sign Up to like & getrecommendations! Published in 2018 at "Science and Technology of Advanced Materials"
DOI: 10.1080/14686996.2018.1428877
Abstract: Abstract The mechanism of radiation-induced detwinning is different from that of deformation detwinning as the former is dominated by supersaturated radiation-induced defects while the latter is usually triggered by global stress. In situ Kr ion… read more here.
Keywords: ion irradiation; nanotwinned films; migration; situ ion ... See more keywords
Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films
Sign Up to like & getrecommendations! Published in 2022 at "Materials"
DOI: 10.3390/ma15030937
Abstract: Copper-to-copper (Cu-to-Cu) direct bonding is a promising approach to replace traditional solder joints in three-dimensional integrated circuits (3D ICs) packaging. It has been commonly conducted at a temperature over 300 °C, which is detrimental to… read more here.
Keywords: direct bonding; interfacial characterization; chemical mechanical; temperature ... See more keywords