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Near-junction cooling for next-generation power electronics

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0 Published in 2019 at "International Communications in Heat and Mass Transfer"

DOI: 10.1016/j.icheatmasstransfer.2019.104300

Abstract: Abstract This article focuses on chip-scale single-phase cooling for high heat flux and high temperature power device operation. This technology is focused on future wide band-gap semiconductors, which are expected to survive harsh environments. To… read more here.

Keywords: power; power electronics; junction cooling; near junction ... See more keywords