Copper-Based Volumetric Filler Dedicated for Ag Paste for Depositing the Front Electrodes by Printing on Solar Si Cells
Sign Up to like & getrecommendations! Published in 2018 at "Materials"
DOI: 10.3390/ma11122493
Abstract: In this work we present research results on a new paste NPCuXX (where: NP—new paste, CuXX—component, XX—a modifier consisting of Ni and other important elements) based on a copper composite (CuXX) for fabrication of front… read more here.
Keywords: new paste; cuxx; paste; copper ... See more keywords