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Published in 2019 at "Analog Integrated Circuits and Signal Processing"
DOI: 10.1007/s10470-019-01448-4
Abstract: The switching noise generated in digital circuits propagates through conductive silicon substrate to analog circuits in a mixed-signal CMOS LSI. Substrate noise coupling may degrade the performance of the analog circuits, and may result in…
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Keywords:
substrate noise;
noise;
noise coupling;
wake receiver ... See more keywords
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Published in 2020 at "Journal of Computational Electronics"
DOI: 10.1007/s10825-020-01466-w
Abstract: With the application of heterogeneous integration and advanced packaging technologies, the use of through-silicon vias (TSVs) to deliver the power supply has become popular in the design of stacked chips in three-dimensional integrated circuits. High-density vertical…
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Keywords:
network;
tsv noise;
analysis;
power ... See more keywords
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Published in 2021 at "Journal of Applied Mathematics and Computing"
DOI: 10.1007/s12190-021-01553-6
Abstract: In this contribution, two delayed commensalism models with noise coupling and interval biological parameters are constructed, in which the positive and negative intrinsic growth rates of commensal species are respectively considered. Two sets of sufficient…
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Keywords:
biological parameters;
models noise;
noise coupling;
commensalism models ... See more keywords
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Published in 2022 at "IEEE Transactions on Circuits and Systems II: Express Briefs"
DOI: 10.1109/tcsii.2022.3182406
Abstract: A hybrid noise-coupling (HNC) technique is proposed to mitigate the issues with a digital noise-coupling (DNC) structure. In the proposed technique, the unwanted quantization noise that is generated from the noise-coupling analog-to-digital converter (ADC) is…
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Keywords:
noise;
continuous time;
noise coupling;
order continuous ... See more keywords
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Published in 2021 at "IEEE Transactions on Electromagnetic Compatibility"
DOI: 10.1109/temc.2021.3059846
Abstract: In this article, we first measured through glass via (TGV) noise coupling and the effectiveness of shielding structures in a glass interposer. To analyze the noise coupling between signal TGVs, an open-ended structure is adopted.…
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Keywords:
noise coupling;
glass interposer;
shielding structures;
signal tgvs ... See more keywords
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Published in 2017 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2016.2604818
Abstract: This paper presents a methodology to analyze the substrate noise coupling and reduce their effects in smart power integrated circuits. This methodology considers the propagation of minority carriers in the substrate. Hence, it models the…
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Keywords:
methodology;
smart power;
power;
noise coupling ... See more keywords