Interconnection method based on solder-filled nanoporous copper as interlayer for high-temperature applications
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DOI: 10.1016/j.mee.2019.04.027
Abstract: Abstract In this study, the nanoporous copper (NPC) sheets were fabricated by dealloying Cu40Al60 precursor alloy in 1.45 mol/L dilute hydrochloric acid solution under water bath at 80 °C for 12 h. The NPC sheets had a typical… read more here.
Keywords: nanoporous copper; solder; temperature; npc sheets ... See more keywords