An observation and explanation of interior cracking at the interface of solder by electromigration
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DOI: 10.1016/j.microrel.2019.04.013
Abstract: Abstract The electromigration (EM) of a solder joint under high-current stressing causes damage and reduces its service life. Previous studies have suggested that EM-induced cracks typically initiate at the cathode corner where the electron current… read more here.
Keywords: explanation interior; solder; interface; electron current ... See more keywords