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Published in 2023 at "ACS applied materials & interfaces"
DOI: 10.1021/acsami.3c03728
Abstract: While dimensional change under thermal loading dictates various device failure mechanisms in soft materials, the interplay between microstructures and thermal expansion remains underexplored. Here, we develop a novel method to directly probe the thermal expansion…
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Keywords:
observation highly;
thermal expansion;
polymer films;
highly anisotropic ... See more keywords