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Published in 2019 at "IEEE Photonics Technology Letters"
DOI: 10.1109/lpt.2019.2948364
Abstract: Packaging efficiency and optical performances are important indexes for white light-emitting diodes (WLEDs) packaging. In this letter, wafer-level WLEDs packaging were presented by printing phosphor on three-dimensional (3D) ceramic substrate to improve packaging efficiency and…
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Keywords:
packaged using;
ceramic substrate;
using ceramic;
optical consistency ... See more keywords