LAUSR

Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames

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1 Published in 2020 at "Materials"

DOI: 10.3390/ma13051191

Abstract: Previous studies merely focus on the hot dipping properties of lead frame materials used in electronic industry. Yet, the environmentally friendly and cost-efficient traits of hot-dipped tinning process make it a possible promising surface modification… read more here.

Keywords: tinning process; hot dipped; process routine; dipped tinning ... See more keywords