Guided GA-Based Multiobjective Optimization of Placement and Assignment of TSVs in 3-D ICs
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DOI: 10.1109/tvlsi.2019.2908087
Abstract: The advent of 3-D IC technology facilitates the fabrication of large electronic circuits on small-area chips ensuring high performance. For a 3-D IC, the problem of placement followed by the assignment of through-silicon vias (TSVs)… read more here.
Keywords: optimization; optimization placement; based multiobjective; guided based ... See more keywords