LAUSR

Optimizing the dicing saw parameters of 60 μm wafer dicing street

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1 Published in 2018 at "Microsystem Technologies"

DOI: 10.1007/s00542-017-3553-z

Abstract: Wafer surface dicing chipping can expand to impact chip circuits, which may cause serious defects during the IC assembly process, potentially resulting in IC circuit function failure. Throughout the semiconductor wafer process, the street design… read more here.

Keywords: street; dicing saw; optimizing dicing; wafer dicing ... See more keywords