Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
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DOI: 10.1038/s41467-019-10412-9
Abstract: Multilevel metal interconnects are crucial for the development of large-scale organic integrated circuits. In particular, three-dimensional integrated circuits require a large number of vertical interconnects between layers. Here, we present a novel multilevel metal interconnect… read more here.
Keywords: integrated circuits; stacked organic; organic integrated; metal ... See more keywords