Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
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DOI: 10.1038/s41598-018-32280-x
Abstract: A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth… read more here.
Keywords: copper; oriented nanotwinned; direct bonding; vacuum ... See more keywords