A Low-Overhead Integrated Aging and SEU Sensor
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2018.2817369
Abstract: Aging has become a critical CMOS reliability issue in nanoscales. In general, the aging effect is exhibited as an increase in the delay of the combinational parts and robustness degradation of memory structures. To monitor… read more here.
Keywords: integrated aging; overhead; low overhead; aging seu ... See more keywords