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Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-03507-3
Abstract: Increased heat generated in high-density electronic devices has intensified the search for advanced thermal management solutions. This urge has prompted various studies in thermal pad, liquid thermal interface material, gap fillers, and thermal coating, etc.,…
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Keywords:
anodic aluminum;
electronic packaging;
oxide nanopore;
aluminum oxide ... See more keywords