In Situ Contact Pressure Monitoring of Press Pack Power Module Using FBG Sensors
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DOI: 10.1109/tim.2022.3193950
Abstract: For press pack power semiconductor modules, the contact pressure is a key parameter to monitor their operating condition and health status. Direct internal measurement using conventional sensors has been difficult due to the restricted space… read more here.
Keywords: pack power; fbg sensors; contact pressure; press pack ... See more keywords