Design, Test, and Evaluation of a Novel Die-Attach Structure for Packaging Stress Suppression of MEMS Resonant Accelerometers
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DOI: 10.1109/tim.2024.3470046
Abstract: An effective suppression of packaging stress is significant for MEMS-based inertial sensors in the application of high-performance navigation systems. This article proposes a novel glass gasket with an aim to cushion the die-attach thermal stress… read more here.
Keywords: mems resonant; packaging stress; stress; die attach ... See more keywords