Articles with "packaging structure" as a keyword



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Experimental Investigation on the Moisture Stability of QDs-LEDs With Layered Packaging Structure

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Published in 2020 at "IEEE Photonics Technology Letters"

DOI: 10.1109/lpt.2020.3029622

Abstract: Quantum dots (QDs)/phosphor hybrid white light emitting diodes (QDs-LEDs) have attracted extensive attention in recent years due to their advantages of high light efficiency and high color rendering index (CRI). However, the QDs present poor… read more here.

Keywords: packaging structure; moisture stability; stability; stability qds ... See more keywords
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Flexible PCB-Based 3-D Integrated SiC Half-Bridge Power Module With Three-Sided Cooling Using Ultralow Inductive Hybrid Packaging Structure

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Published in 2019 at "IEEE Transactions on Power Electronics"

DOI: 10.1109/tpel.2018.2866404

Abstract: Silicon carbide (SiC) devices are capable of high switching speeds and also enable high switching frequency in power electronic converters. However, this feature poses substantial challenges to packaging, especially limiting the loop inductance. The traditional… read more here.

Keywords: hybrid packaging; packaging structure; power module; power ... See more keywords