β-Ga₂O₃: Ultralow loss and low permittivity dielectric ceramics for high-frequency packaging substrate
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DOI: 10.1039/d3qi00578j
Abstract: As the core carrier of integrated circuits, packaging substrate usually responds in time to the evolution of electronic products. Among which, ceramic substrate materials are desired to have excellent dielectric... read more here.
Keywords: ultralow loss; permittivity dielectric; low permittivity; packaging substrate ... See more keywords