D‐band waveguide‐to‐microstrip transition implemented in eWLB packaging technology
Sign Up to like & getrecommendations! Published in 2020 at "Electronics Letters"
DOI: 10.1049/el.2019.3331
Abstract: This Letter presents a non-galvanic D-band (110-170 GHz) interconnect realised in embedded wafer level ball grid array (eWLB) packaging technology. The interconnect consists of a patch-radiator-based waveguide transition implemented using one of the technology's redistribution… read more here.
Keywords: transition implemented; ewlb packaging; band; technology ... See more keywords
Functional Polymer and Packaging Technology for Bakery Products
Sign Up to like & getrecommendations! Published in 2022 at "Polymers"
DOI: 10.3390/polym14183793
Abstract: Polymeric materials including plastic and paper are commonly used as packaging for bakery products. The incorporation of active substances produces functional polymers that can effectively retain the quality and safety of packaged products. Polymeric materials… read more here.
Keywords: bakery products; quality packaged; packaging technology; bakery ... See more keywords