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Published in 2020 at "Electronics Letters"
DOI: 10.1049/el.2019.3331
Abstract: This Letter presents a non-galvanic D-band (110-170 GHz) interconnect realised in embedded wafer level ball grid array (eWLB) packaging technology. The interconnect consists of a patch-radiator-based waveguide transition implemented using one of the technology's redistribution…
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Keywords:
transition implemented;
ewlb packaging;
band;
technology ... See more keywords
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Published in 2025 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2025.3557461
Abstract: On-chip bandpass filter (BPF) designs with high out-of-band rejection are proposed by virtue of 3-D glass-based advanced packaging technology. The proposed BPF design employs multiple coupling cells based on a combination of new mixed 2-D…
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Keywords:
technology;
glass based;
advanced packaging;
packaging technology ... See more keywords
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Published in 2024 at "Comprehensive reviews in food science and food safety"
DOI: 10.1111/1541-4337.70058
Abstract: Food packaging is essential for preserving food safety and quality while also addressing environmental concerns. Designers are at the forefront of developing packaging solutions that not only meet functional requirements but also align with evolving…
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Keywords:
food;
consumer;
food packaging;
packaging technology ... See more keywords
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Published in 2022 at "Polymers"
DOI: 10.3390/polym14183793
Abstract: Polymeric materials including plastic and paper are commonly used as packaging for bakery products. The incorporation of active substances produces functional polymers that can effectively retain the quality and safety of packaged products. Polymeric materials…
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Keywords:
bakery products;
quality packaged;
packaging technology;
bakery ... See more keywords