Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
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DOI: 10.1109/tcpmt.2018.2848665
Abstract: The design, materials, process, fabrication, and reliability of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this paper. Emphasis is placed on the application of a special… read more here.
Keywords: panel level; heterogeneous integration; level packaging; fan panel ... See more keywords
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2023.3267411
Abstract: Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal–oxide–semiconductor… read more here.
Keywords: ant colony; packaging; reliability; panel level ... See more keywords
Warpage Estimation and Demonstration of Panel-Level Fan-Out Packaging With Cu Pillars Applied on a Highly Integrated Architecture
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2023.3269424
Abstract: Fan-out panel-level packaging (FO-PLP) has become a critical forward-looking technology because it can meet the demands for small size, high input–output counts, and multichip functions. Moreover, a 3-D stacked architecture called packaging-on-packaging can be achieved… read more here.
Keywords: fan; warpage; packaging; plp ... See more keywords