Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates
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DOI: 10.1016/j.mee.2020.111330
Abstract: Abstract In light of the necessity to introduce new techniques for hybrid integration of semiconductor dies on temperature and pressure-sensitive substrates, the feasibility of employing thermosonic flipchip bonding on screen printed paper and PET substrates… read more here.
Keywords: paper; screen printed; flipchip bonding; paper pet ... See more keywords