High-speed formation of a near-full-density bondline in sinter-bonding below 250°C using 2 µm Cu particles coated with Ag
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DOI: 10.1080/00325899.2020.1820664
Abstract: ABSTRACT High-speed attachment of dies on an Ag finish was demonstrated through pressure-assisted sinter-bonding at temperatures read more here.
Keywords: 250 using; particles coated; near full; using particles ... See more keywords