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Published in 2018 at "IEEE Microwave and Wireless Components Letters"
DOI: 10.1109/lmwc.2018.2854552
Abstract: This letter develops a simplified circuit model for the shielded differential through-silicon vias (SD-TSVs). The model is consisted of four frequency-independent elements and can accurately predict the insertion loss of the SD-TSVs up to 20…
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Keywords:
silicon vias;
equalizer;
passive equalizer;
differential silicon ... See more keywords