Conductive-paste-based high-yielding interconnection process for c-Si photovoltaic modules with 50 µm thin cells
Sign Up to like & getrecommendations! Published in 2018 at "Solar Energy Materials and Solar Cells"
DOI: 10.1016/j.solmat.2018.02.032
Abstract: Abstract Thin crystalline silicon (c-Si) photovoltaic (PV) cells ( 200 °C) soldering causes frequent wafer breakage in thin c-Si-based modules. Hence, in this work, we proposed low-temperature interconnection method using conductive paste (CP) for thin c-Si… read more here.
Keywords: interconnection; conductive paste; cells conductive; photovoltaic ... See more keywords
High-Yield Paste-Based Synthesis of Thiolate-Protected Silver Nanoparticles
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Physical Chemistry C"
DOI: 10.1021/acs.jpcc.6b12427
Abstract: Nanoparticles rival pharmaceuticals in synthetic inefficiency, in particular as measured by process mass intensity, with by far the largest contribution to waste being from solvents. We have therefore developed a greener method of synthesizing silver… read more here.
Keywords: based synthesis; silver nanoparticles; paste; paste based ... See more keywords
A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging
Sign Up to like & getrecommendations! Published in 2022 at "Materials"
DOI: 10.3390/ma15030914
Abstract: A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this… read more here.
Keywords: attachment power; paste based; die attachment; nanoparticles die ... See more keywords