High-accuracy three-dimensional shape measurement of micro solder paste and printed circuits based on digital image correlation
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DOI: 10.1117/1.oe.57.5.054101
Abstract: Abstract. There is an urgent demand for high-accuracy, real-time three-dimensional (3-D) shape measurements in industrial production as an ideal tool for quality control. Based on 3-D digital image correlation (3D-DIC), in this study, we measured… read more here.
Keywords: shape; solder paste; printed circuits; accuracy ... See more keywords