3D patterning of silicon by contact etching with anodically biased nanoporous gold electrodes
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DOI: 10.1016/j.elecom.2017.01.014
Abstract: A novel strategy to achieve 3D pattern transfer into silicon in a single step without using lithography is presented. Etching is performed electrochemically in HF media by contacting silicon with a positively biased, patterned, metal… read more here.
Keywords: metal; patterning silicon; electrode; silicon ... See more keywords