Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures
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DOI: 10.1007/s10854-019-01601-9
Abstract: Nanosilver paste as a state-of-the-art die-attach material for power electronics has been widely used in bare copper bonding. In this paper, bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures… read more here.
Keywords: performance sintered; bare copper; copper; grain ... See more keywords