The effect of interlayer thickness, bonding temperature and atmosphere on transient liquid phase bonding of GTD-111 to FSX-414
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Processing Technology"
DOI: 10.1016/j.jmatprotec.2018.01.022
Abstract: Abstract The amount of γ/nickel boride/Ni-B-Si ternary eutectic in the athermally solidified zone of joints was increased with increased thickness of the filler metal. By increasing the temperature from 1130 °C to 1160 °C, isothermal solidification was… read more here.
Keywords: phase; transient liquid; temperature; liquid phase ... See more keywords
Microstructure evolution of Mg/Cu dissimilar metal jointed by ultrasonic-induced transient liquid phase bonding with Zn interlayer
Sign Up to like & getrecommendations! Published in 2019 at "Materials Characterization"
DOI: 10.1016/j.matchar.2019.109897
Abstract: Abstract Ultrasonic-induced transient liquid phase bonding of Mg/Cu dissimilar alloys with Zn interlayer was carried out. The effects of pressure and temperature on the microstructure and mechanical properties of the weld seam were investigated. The… read more here.
Keywords: induced transient; transient liquid; ultrasonic induced; liquid phase ... See more keywords
Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics
Sign Up to like & getrecommendations! Published in 2019 at "Applied Sciences"
DOI: 10.3390/app9030529
Abstract: In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the… read more here.
Keywords: phase bonding; liquid phase; bonding copper; transient liquid ... See more keywords