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Published in 2017 at "IEEE Transactions on Semiconductor Manufacturing"
DOI: 10.1109/asmc.2016.7491161
Abstract: For an advanced NAND flash memory device, there is a failure mechanism known as “blown gate oxide” that is commonly sourced to the plasma-enhanced chemical vapor deposition (PECVD) amorphous carbon deposition step. It has been…
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Keywords:
photovoltage measurements;
carbon deposition;
deposition;
surface photovoltage ... See more keywords