Total physical thickness measurement of a multi-layered wafer using a spectral-domain interferometer with an optical comb.
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DOI: 10.1364/oe.25.012689
Abstract: An interferometric method using an optical comb is proposed and realized to measure the total physical thickness of a multi-layered wafer even if the refractive index of each layer is not given. For a feasibility… read more here.
Keywords: layered wafer; optical comb; total physical; physical thickness ... See more keywords