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Published in 2017 at "Networks"
DOI: 10.1364/networks.2017.new1b.4
Abstract: MACOM has addressed the DC Interconnect module model by developing a platform providing a solution minimizing module yield problems merged with a cost effective manufacturing approach to provide silicon photonic circuits with integrated lasers.
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Keywords:
laser integrated;
integrated pic;
networks macom;
macom pic ... See more keywords