Advances in diversified application of pillar[n]arenes
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Inclusion Phenomena and Macrocyclic Chemistry"
DOI: 10.1007/s10847-020-00986-z
Abstract: Pillar[n]arenes have become a research hotspot in recent years. Because of its unique electron-rich cavity and easy functionalization, pillar[n]arenes have been extensively studied as carrier materials for applications in materials science, life science, nanoscience, information… read more here.
Keywords: diversified application; pillar arenes; application pillar; advances diversified ... See more keywords
Combined application of patchwork and partial softening to enhance the collision resistance of the center pillar
Sign Up to like & getrecommendations! Published in 2020 at "International Journal of Crashworthiness"
DOI: 10.1080/13588265.2020.1836881
Abstract: Hot press formed parts in a fully martensitic structure limit its application in the centre pillar, which requires high collision resistance. In this study, the combined effect of the patchwork and... read more here.
Keywords: application; pillar; patchwork; collision resistance ... See more keywords
CO2 Wetting on Pillar-Nanostructured Substrates.
Sign Up to like & getrecommendations! Published in 2020 at "Nanotechnology"
DOI: 10.1088/1361-6528/ab7c49
Abstract: CO2 capture by dropwise CO2 condensation on cold solid surfaces is a promising technology. Understanding the role of nanoscale surface and topographical features on the CO2 droplet wetting characteristics is of importance for CO2 capture… read more here.
Keywords: co2 droplet; co2 capture; co2; co2 phobic ... See more keywords
Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Electron Device Letters"
DOI: 10.1109/led.2020.3001163
Abstract: Low-thermal-budget (180 °C for 15 sec) Cu pillar to Cu pillar bonding with Pd passivation under the atmosphere is developed without any planarization pretreatment before the bonding process. The bonded structure is investigated with material… read more here.
Keywords: passivation; copper; temperature copper; copper copper ... See more keywords
Material Limit of Power Devices—Applied to Asymmetric 2-D Superjunction MOSFET
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Electron Devices"
DOI: 10.1109/ted.2018.2839180
Abstract: In spite of the reporting of several mathematical approaches dealing with the behavior of the superjunction MOSFET’s specific resistance, a study for the asymmetrical pillar (when the width of the n-pillar and the p-pillar are… read more here.
Keywords: power devices; superjunction mosfet; limit power; material limit ... See more keywords