Enhancement of Cu pillar bumps by electroless Ni plating
Sign Up to like & getrecommendations! Published in 2017 at "Microelectronic Engineering"
DOI: 10.1016/j.mee.2017.05.055
Abstract: Abstract Cu pillar bumps were mechanically enhanced using electroless Ni plating for fine-pitch electronic packaging applications. The interfacial reaction and mechanical properties of the Ni-plated Cu pillar bump joints were evaluated. After reflowing, the plated… read more here.
Keywords: electroless plating; enhancement pillar; bumps electroless; pillar bumps ... See more keywords
Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish
Sign Up to like & getrecommendations! Published in 2023 at "Materials"
DOI: 10.3390/ma16041739
Abstract: Thermo-compression bonding (TCB) properties of Cu/SnAg pillar bumps on electroless palladium immersion gold (EPIG) were evaluated in this study. A test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the… read more here.
Keywords: surface finish; surface; epig; snag pillar ... See more keywords