Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding
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DOI: 10.3390/ma17225405
Abstract: With the advancement of high-integration and high-density interconnection in chip manufacturing and packaging, Cu bumping technology in wafer- and panel- level packaging is developed to micrometer-sized structures and pitches to accommodate increased I/O numbers on… read more here.
Keywords: effect; solder joint; solder; pillar electroplating ... See more keywords