Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement
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DOI: 10.1109/tpel.2021.3106316
Abstract: Double-sided cooling based on planar packaging method features better thermal performance than traditional single-sided cooling based on wire bonds. However, this method still faces thermal and electrical challenges in multichip SiC power modules. Specifically, one… read more here.
Keywords: power; planar packaging; packaging; sic power ... See more keywords