Development of n+-in-p planar pixel quadsensor flip-chipped with FE-I4 readout ASICs
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Instrumentation"
DOI: 10.1088/1748-0221/12/01/c01084
Abstract: We have developed flip-chip modules applicable to the pixel detector for the HL-LHC. New radiation-tolerant n+-in-p planar pixel sensors of a size of four FE-I4 application-specific integrated circuits (ASICs) are laid out in a 6-in… read more here.
Keywords: flip; bump bonding; quadsensor; pixel ... See more keywords
arXiv : Characterisation of novel thin n-in-p planar pixel modules for the ATLAS Inner Tracker upgrade
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Instrumentation"
DOI: 10.1088/1748-0221/13/01/c01009
Abstract: In view of the high luminosity phase of the LHC (HL-LHC) to start operation around 2026, a major upgrade of the tracker system for the ATLAS experiment is in preparation. The expected neutron equivalent fluence… read more here.
Keywords: charge collection; tracker; thin planar; pixel ... See more keywords