A Comprehensive Modeling Platform for Interconnect Technologies
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Electron Devices"
DOI: 10.1109/ted.2023.3261828
Abstract: With device scaling facing major physical and manufacturing challenges, many research efforts have been focused on the impact of device parameters and designs on circuit performance and power dissipation. However, similar research on the impact… read more here.
Keywords: comprehensive modeling; circuit; interconnect technologies; platform interconnect ... See more keywords