Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging
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DOI: 10.1007/s10854-018-0423-0
Abstract: In this work, the interfacial reactions and IMC growth of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu were studied during reflowing at 220 °C for 10 min and solid–state treatment at 150 °C with various aging times. For… read more here.
Keywords: layer; electroless plating; 35bi 1ag; plating layer ... See more keywords