Cyber-physical production system approach for energy and resource efficient planning and operation of plating process chains
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Cleaner Production"
DOI: 10.1016/j.jclepro.2020.125160
Abstract: Abstract Plating process chains are characterized by a high specific energy and resource demand as well as a high complexity due to dynamic interdependencies between and within processing steps. Planning and operating plating process chains… read more here.
Keywords: production; energy; process; plating process ... See more keywords
Effect of nickel electroplating followed by a further copper electroplating on the micro-structure and mechanical properties of high modulus carbon fibers
Sign Up to like & getrecommendations! Published in 2021 at "Materials Today Communications"
DOI: 10.1016/j.mtcomm.2021.102345
Abstract: Abstract The nickel electroplating followed by a further copper electroplating process was conducted on high modulus carbon fibers (HMCFs), and the HMCFs were oxidized in nitric acid prior to the Ni-plating process. Effect of the… read more here.
Keywords: nickel electroplating; followed copper; plating process; process ... See more keywords
The effects of ultrasonic vibration on mechanical properties of tungsten particle-reinforced copper-matrix composites
Sign Up to like & getrecommendations! Published in 2017 at "Canadian Metallurgical Quarterly"
DOI: 10.1080/00084433.2017.1361182
Abstract: ABSTRACT W-Cu micro-powder mixtures usually have poor sinterability due to the relatively low solubility of W in both solid and liquid Cu. In fabricating W-Cu composites, an electroless copper plating process is often used to… read more here.
Keywords: ultrasonic vibration; plating process; particle; mechanical properties ... See more keywords
A Study of Low-Cost Sequential Electroplating Bumping Process and its Metallurgical Behavior
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.2978432
Abstract: Studies were conducted to validate from a metallurgical point of view whether a lower cost sequential plating approach to SnAg and SnAgCu (SAC) solder bumping is a suitable alternative to the conventional alloy plating process.… read more here.
Keywords: plating process; sequential plating; cost sequential; study low ... See more keywords
Electroless Plating Process Optimization for Successful Copper Coatings Deposition on Surgical Tools
Sign Up to like & getrecommendations! Published in 2025 at "Archives of Metallurgy and Materials"
DOI: 10.24425/amm.2025.154495
Abstract: Copper coatings are valued for their protective, decorative, and antibacterial properties, driving their market growth. Traditional electroless copper baths use cupric sulphate (CuSO4) and carcinogenic formaldehyde (HCOOH), which harms the environment and humans. This study… read more here.
Keywords: successful copper; copper coatings; deposition; copper ... See more keywords