Cyber-physical production system approach for energy and resource efficient planning and operation of plating process chains
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Cleaner Production"
DOI: 10.1016/j.jclepro.2020.125160
Abstract: Abstract Plating process chains are characterized by a high specific energy and resource demand as well as a high complexity due to dynamic interdependencies between and within processing steps. Planning and operating plating process chains… read more here.
Keywords: production; energy; process; plating process ... See more keywords
Effect of nickel electroplating followed by a further copper electroplating on the micro-structure and mechanical properties of high modulus carbon fibers
Sign Up to like & getrecommendations! Published in 2021 at "Materials Today Communications"
DOI: 10.1016/j.mtcomm.2021.102345
Abstract: Abstract The nickel electroplating followed by a further copper electroplating process was conducted on high modulus carbon fibers (HMCFs), and the HMCFs were oxidized in nitric acid prior to the Ni-plating process. Effect of the… read more here.
Keywords: nickel electroplating; followed copper; plating process; process ... See more keywords
The effects of ultrasonic vibration on mechanical properties of tungsten particle-reinforced copper-matrix composites
Sign Up to like & getrecommendations! Published in 2017 at "Canadian Metallurgical Quarterly"
DOI: 10.1080/00084433.2017.1361182
Abstract: ABSTRACT W-Cu micro-powder mixtures usually have poor sinterability due to the relatively low solubility of W in both solid and liquid Cu. In fabricating W-Cu composites, an electroless copper plating process is often used to… read more here.
Keywords: ultrasonic vibration; plating process; particle; mechanical properties ... See more keywords
A Study of Low-Cost Sequential Electroplating Bumping Process and its Metallurgical Behavior
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.2978432
Abstract: Studies were conducted to validate from a metallurgical point of view whether a lower cost sequential plating approach to SnAg and SnAgCu (SAC) solder bumping is a suitable alternative to the conventional alloy plating process.… read more here.
Keywords: plating process; sequential plating; cost sequential; study low ... See more keywords