Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process
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DOI: 10.1007/s11664-018-6335-1
Abstract: The electroless nickel immersion gold process often produces defects, such as pinholes and black pads that can cause brittle fractures at the interface between the solder and metal pad. Contamination in electroless Ni plating solutions… read more here.
Keywords: mto; plating solutions; mto solutions; electroless plating ... See more keywords
Supercapacitive performance of electrochemically synthesized nanocrystalline MnO2 films using different plating solutions: A comparative study
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2018.03.271
Abstract: In this paper we report the comparative supercapacitive performance of the electrodeposited MnO2 films prepared using different plating solutions, namely KMnO4, MnSO4 and Mn(CH3COO)(2). All the MnO2 films possess the hexagonal phase of epsilon manganese… read more here.
Keywords: plating solutions; using different; mno2 films; supercapacitive performance ... See more keywords