Investigation on the underwater femtosecond laser polishing SiC ceramic
Sign Up to like & getrecommendations! Published in 2020 at "Ferroelectrics"
DOI: 10.1080/00150193.2020.1761699
Abstract: Abstract Owing to high hardness and high brittleness of SiC ceramic, it is difficult to machine into structural ceramic components with desired surface quality and dimensional accuracy. In this paper, a method of polishing SiC… read more here.
Keywords: laser; sic ceramic; surface; femtosecond laser ... See more keywords
Influences of Nonaqueous Slurry Components on Polishing 4H-SiC Substrate with a Fixed Abrasive Pad
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DOI: 10.3390/cryst13060869
Abstract: 4H-SiC wafers are more likely to sustain a lower material removal rate (MRR) and severe subsurface damage in conventional chemical mechanical polishing (CMP) methods. To overcome the material removal bottleneck imposed by aqueous chemistry, a… read more here.
Keywords: sic wafers; material removal; nonaqueous slurry; polishing sic ... See more keywords