Thermoplastic polyimide with low dielectric properties enabled by the 2,2′‐spirobifluorene group
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DOI: 10.1002/app.55686
Abstract: Thermoplastic polyimides (TPIs) have melt‐processability and adhesive ability, besides the intrinsic advantages of polyimides. To meet the requirements of applications in high‐frequency communication, TPIs with low dielectric constant (Dk)/dielectric loss factor (Df) at high frequency… read more here.
Keywords: polyimide low; thermoplastic polyimide; low dielectric; polymer chains ... See more keywords