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Published in 2021 at "Colloids and Surfaces A: Physicochemical and Engineering Aspects"
DOI: 10.1016/j.colsurfa.2021.126907
Abstract: Abstract Adhesive sintered Cu nanoparticles (NPs) with low resistivity (41.0 µΩ cm) were formed on polyimide (PI) substrates using well-dispersed Cu NP inks containing polyvinylpyrrolidone (PVP), and their flexibilities were improved by combining the Cu…
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Keywords:
polyvinylpyrrolidone;
pvp;
flexible adhesive;
adhesive sintered ... See more keywords
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Published in 2020 at "ACS applied materials & interfaces"
DOI: 10.1021/acsami.9b21053
Abstract: The synthesis of solution-processed two-dimensional (2D) layered organohalide (CH3(CH2)3NH3)2(CH3NH3)n-1PbnI3n+1 (n = 2, 3, and 4) perovskites is presented, where inkjet printing was used to fabricate heterostructure flexible photodetector (PD) devices on polyimide (PI) substrates. Inks…
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Keywords:
layered perovskites;
inkjet printed;
perovskites high;
organohalide layered ... See more keywords
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Published in 2019 at "Applied Physics Letters"
DOI: 10.1063/1.5132716
Abstract: We experimentally demonstrate that electromagnetically thin polyimide substrates can mitigate substrate-induced detrimental effects to the performance of metallic metasurfaces. A planar quarter-wave plate for the microwave K-band is fabricated on a polyimide substrate of deep…
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Keywords:
electromagnetically thin;
wave plate;
quarter wave;
polyimide substrates ... See more keywords
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Published in 2019 at "Semiconductors"
DOI: 10.1134/s1063782619050257
Abstract: The results of an investigation into the thermoelectric power of thin block Bi1 –xSbx films (0 ≤ x ≤ 0.15) 100–1000 nm in thickness on mica and polyimide substrates in the temperature range of 77–300…
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Keywords:
xsbx films;
bi1 xsbx;
power;
mica polyimide ... See more keywords